Abstract
Effects of the conditions of chemical bath deposition（CBD）and chemical reduction for the fabrication of Cu（OH）2/Cu（O,S）bilayers on glass substrate were investigated by the structural and electrical characterizations with X-ray diffraction, FE-SEM observation, and measurements of electric properties. The Cu（OH）2/Cu（O,S）bilayers were fabricated by sequential CBD processing in Cu-ammonia complex aqueous solutions with urea or thiourea, and the chemical reduction was performed by immersion into sodium borohydride aqueous solutions. The CBD deposition times of Cu（O,S）and Cu（OH）2 layers,（tCu（OH）2, tCu（O,S））, were varied from 30 s to 5 min. and 2 min. to 15 min., respectively, and the chemical reduction time was varied from 1 min to 3 min. The thickness of the Cu, Cu（OH）2 and Cu（O,S）layers decreased with decrease in（tCu（OH）2＋tCu（O,S））. And, the lattice contraction for Cu was observed for（tCu（OH）2＋tCu（O,S））less than 6 min. The resistance and resistivity were almost constant at approximately 1.4 Ω/□ and 4×10−6 Ωcm for（tCu（OH）2＋tCu（O,S））longer than 9 min, and increased drastically with decrease for （tCu（OH）2＋tCu（O,S））less than 6 min, because of the small grain size, increased heterogenous strain, and isolation of Cu grains. The resistance of Cu layers fabricated at（tCu（OH）2＋tCu（O,S））＝6 min decreased to 0.9 Ω/□ with increase in chemical reduction time to 3 min, and decreased further to 0.05 Ω/□ when using an electroless Cu deposition.
