Abstract
Immersion gold plating has hitherto been roughly classified into displacement plating and chemical plating, both of which have been unsatisfactory in plating rate and plating thickness.
This paper reports the development of a displacement plating solution of new mechanism. The solution containing such active metallic ions as Zn, Co, Ni, Cu, etc., so to speak double displacement type solution, has double plating rate and markedely thicker plating is possible in this solution.
The exalting mechanism of the newly developed solution with active metallic ion could almost be made clear by observing the electrode potential and the initial plating appearance.
