Journal of the Metal Finishing Society of Japan
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
Electroplating Bath for Copper Composed of Cupric Citrate Complex
Kunisuke HOSOKAWAKageaki SUEMATSU
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1964 Volume 15 Issue 10 Pages 404-408

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Abstract
The reaction of the formation of complex salt between cupric and citrate ions was investigated with spectrophotometer. It was found that stable cupric citrate was formed in the range of pH 5.5-12.0, and its dissociation constant was 7.80×10-6 at pH 7.0.
By the application of the above complex salt solution to the electroplating bath for copper, adherent and lustrous deposit of copper was obtained on steel.
The composition of the electrolyte and the conditions of electrolysis are as follows.
Cupric sulfate 0.5mol/l
Sodium citrate 1.0mol/l
pH 4.0-5.0
Temperature 40-50°C
Cathode current density 0.3-0.8A/dm2
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© The Surface Finishing Society of Japan
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