Journal of the Metal Finishing Society of Japan
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
Electrodeposition of Copper from Ethylene-diamine Bath
Tadayoshi INUIKunisuke HOSOKAWAKunio OZAKI
Author information
JOURNAL FREE ACCESS

1969 Volume 20 Issue 6 Pages 284-289

Details
Abstract
Investigations were made on the formation of chelate by the reaction between cupric ion and ethylene diamine (En), and the effect of pH on the structure of chelates.
The following results were obtained.
1) The chelate compound (CuEn)2+ was formed by the reaction between En and cupric ion in the pH range of 3.5-5.5 and the compound (CuEn2)2+ was formed in the range of above 6.0. However, in the range of 5.5-6.0, the both complex ions, (CuEn)2+ and (CuEn2)2+, were formed.
2) Bright deposit of copper was obtained on steel with good adhesion from (CuEn2)2+ chelate solution.
The optimum condition of the electrolysis was as follows.
CuSO4·5H2O……75-125g/l pH …… 6.5-8.7
En ……40-65g/l Temperature …… 10-50°C
Na2SO4·10H2O …… 50g/l Cathodic current density…… 1.5-2.5amp./dm2
(NH4)2 SO4 ……50g/l
The current efficieney under the above condition was above 95%.
Content from these authors
© The Surface Finishing Society of Japan
Previous article Next article
feedback
Top