Journal of the Metal Finishing Society of Japan
Online ISSN : 1884-3395
Print ISSN : 0026-0614
ISSN-L : 0026-0614
Copper Plating from Copper-Iodide Complex Solutions
Mikio OGATA
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1974 Volume 25 Issue 1 Pages 20-24

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Abstract
Experiments were conducted to study whether copper-iodide complex solutions would be used as Strike Baths for steel. The suitable conditions of composition and operation of the bath were found to be Cu: 2-10g/l, KI: 160-400g/l, pH: 0-2, current density: 2-10Amp/dm2. Lustrous and adherent deposits were obtained under these conditions. However, the current efficiency was low as less than 24%, because of low copper content of the bath. Copper or nickel was available for the anode, but the copper anode was apt to be passive. Therefore, the ratio of area between anode and cathode had to be kept larger in order to decrease the anodic current densities.
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© The Surface Finishing Society of Japan
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