Abstract
A new electroless copper plating bath containing iminodiacetic acid as a complex agent has been developed and applied to the plating on the sintered PbTiO3-PbZrO3 ceramic substrate. The deposition rate of copper onto ceramics from the new type bath was compared with that from the different baths containing EDTA or Rochelle salt as a function of plating time, pH value and formaldehyde concentration. It was found that the iminodiacetate bath composed of 0.026M copper sulfate, 0.12M iminodiacetic acid and 0.5M formaldehyde at pH12.5, gave a maximum deposition rate which was twice that in EDTA bath and six times that in Rochelle salt bath. Effects of stirring the electroless plating bath and various metallic substrate surfaces on the copper deposition rate were also discussed.
