Abstract
The mechanical properties of copper films deposited from electroless plating baths containing glycine were studied by means of the tension test. The addition of glycine to the baths resulted in an increase in the elongation and ultimate tensile strength of the copper films. Under suitable conditions, the films obtained were shown to have nearly identical elongation and higher ultimate tensile strength, compared with electrodeposits from additive-free copper sulfate baths. The concentration of free formaldehyde that was not involved in the formation of a condensed compound from glycine and formaldehyde in the electroless plating baths was measured by the polarographic method. Good correlations were found between the concentration of free formaldehyde, the mechanical properties and the deposition rate.
