Abstract
A study was conducted on copper electrodeposition from Cu (CF3COO)2 (20g/dm3)-MeOH baths, with an additive (LiCl, NH4Cl, AlCl3, LiBr or NH4Br).
The LiCl additive inhibited the reduction in anode current efficiency during copper electrodeposition from the bath. The bath with LiCl added yielded bright, smooth copper electrodeposits at a wide range of current densities. The surface of the copper deposits was granular and the cross-section of the deposits was found to have granular structure.
