Abstract
The effects of additives and pH on electroless copper plating from EDTA baths were investigated by the interfacial AC impedance method and mixed potential measurement. When pH rose, the mixed potential fell and the value of charge transfer resistance RP decreased. In this condition, the plating process was enhanced. When the additives were added to the solution, they inhibited the cathodic reaction more strongly than the anodic reaction. This increased the RP value and the whole reaction was inhibited.
