Abstract
The corrosion protective properties of electroless Co-Ni-P alloy plating were examined in 5% NaCl solution. The corrosion resistance of Co-P film was better than that of Ni-P film. The corrosion potential of the films was less noble in the order Ni-P, Co-P, Co-Ni-P, and contact corrosion current density in circuits constructed of deposited film and an Fe plate decreased in the same order.
Thus the amount of dissolution of Fe substrate in the corrosive solution decreased and the corrosion protective properties of the depositions on the Fe substrates improved in the same order.
