Abstract
It is known that oxides of copper, nickel, tin, etc. are reduced in hydrogen atmosphere at soldering temperature. In expectation of this hydrogen reduction effect, dull nickel electrodeposits were formed under excess current density to obtain nickel films containing hydrogen and their solderability was measured by meniscograph. The hydrogen content of the nickel electrodeposits, and their crystal structure, composition and morphology were analyzed and correlations between these parameters and solderability investigated.
The results are summarized as follows.
(1) Nickel electrodeposits formed under excess current density showed a marked improvement in solderability.
(2) The crystal structure of the nickel electrodeposits was fcc and the preferential orientation changed with current density, but no correlation was found between solderability and orientation.
(3) There was good correlation between the solderability of the nickel electrodeposits and their hydrogen content.
