Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
The Influence of Adhesive Property of Epoxy Molding Compound to Reliability of Semiconductor Devices
Haruo TABATA
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Keywords: Epoxy Molding Compound, Adhesive Property, Moisture Resistance, Anti-Solder Reflow, Surface
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1993 Volume 44 Issue 12 Pages 1044-1048

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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