Abstract
The effect of various additives on the electrodeposition of copper foil was investigated in order to produce copper foil for use on printed circuit boards. In the initial process of copper deposition, it was possible to evaluate the action mechanism of gelatin precisely using photoacoustic spectroscopy (PAS). At extremely low thiourea concentrations, the surface morphology of the copper deposits showed dendrites unaccompanied by degradation of thiourea complex. The presence of these additives also resulted in the copper deposits showing a (111) preferential orientation, which has excellent etching characteristics for copper foil for use on printed circuit boards.
