Abstract
The electrodeposition of gold from nonaqueous solutions was studied with an electrochemical methods, and the morphology, preferred orientation and grain size of the deposited gold were analyzed by electron microscope or X-ray diffraction.
The properties of the gold deposits were remarkably affected by differences in bath conditions. The hardness and contact resistance of gold film obtained from an organic solvent bath were lower than those of film obtained from an acidic bath containing a small amount of cobalt ion. It is thought that the electrodeposited gold film from a formamid solution may be applicable to connecting materials, since its hardness may be increased by keeping the current under control.
