Abstract
The electrodeposition behaviors of copper and tin from acid sulfate solution have been studied by electrochemical methods. The deposition potential of tin in the presence of copper (II) ion was more positive by 0.25V compared with that in the absence of copper (II) ion. The multilayers have been electrodeposited from acid sulfate baths containing copper (II) and tin (II) ions using potential pulse electrodeposition techniques. The positive potential of the pulse was-0.1V (vs. SCE) and the negative one was-0.35 V, and the retention times at each potential changed from 2 to 8s. The microstructure of the multilayers was examined by scanning electron microscopy and X-ray diffractometry. The multilayers consisting of sublayers with a thickness of 10nm order were obtained depending on the retention times. The sublayers deposited at-0.1V were pure copper and those deposited at-0.35V consisted of Cu, Cu3Sn and Cu6Sn5.
