Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
Through Electrode in Si Wafer
Masataka HOSHINO
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Keywords: Electronic System Integration, Three-Dimensional Packaging, Through via, Wafer Thinning, Flip Chip Bonding, Under-Fill, Thermal Management
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2001 Volume 52 Issue 7 Pages 479-483

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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