Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
“10μm-Rule” Patterning Technology Using Copper Electroplating
Takeshi WAKABAYASHI
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Keywords: Wafer Level CSP, Electroplating, Encapsulation
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2002 Volume 53 Issue 4 Pages 233-238

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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