Transactions of the Society of Heating,Air-conditioning and Sanitary Engineers of Japan
Online ISSN : 2424-0486
Print ISSN : 0385-275X
ISSN-L : 0385-275X
Influences of Both Si Wafer Surface Conditions and Molecular Collision Speeds for Adsorption Behavior by Molecular Simulation
Takeshi TAKATSUKAAkira MIYAMOTOMomoji KUBOAkira ENDOUMichihisa KOYAMAMasazumi GODO
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2007 Volume 32 Issue 129 Pages 13-19

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Abstract
We investigated the influences of both the Si(100) wafer surface conditions and the molecular collision speeds for the adsorption behavior by the molecular dynamics method. In this study, we chose four models of Si(100) wafer, such as the hydrogen-terminated surface, the hydroxy-terminated surface, the oxide surface and the hydrogen-terminated surface with the water molecules. Also, the adsorption of the chemical contaminants, such as Docosahexapentadecan (D5), dibutyl phthalate (DBP), dioctyl phthalate (DOP) and 2-propanol (IPA) which were detected in the environment to manufacture the semiconductor devices, were estimated and compared. We used the cvff as the force field of the molecular dynamics method. As the results, it was confirmed that IPA was more difficult to adsorb to Si surface than the other contaminants. That the chemical contaminants adsorbed onto silicon wafer surface showed a tendency to become easy, when the silicon wafer had water molecules on the surface in the room temperature.
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© 2007 The Society of Heating,Air-Conditioning and Sanitary Engineers of Japan
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