Shigen-to-Sozai
Online ISSN : 1880-6244
Print ISSN : 0916-1740
ISSN-L : 0916-1740
Original Paper
Control of Additives in Copper Electrorefining by Using the Hull Cell Test
Koji ANDONaoyuki TSUCHIDAHiroshi KOMI
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JOURNAL FREE ACCESS

2002 Volume 118 Issue 2 Pages 86-90

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Abstract
To produce high-quality electrolytic copper, the influence of additives on copper electrodeposition was studied, and the design and control of the additives in copper electrorefining were discussed in the present paper. The experiment for the influence of the additives such as glue, thiourea and chloride ion in the copper electrolyte on the surface roughness in electrodeposition were carried out with the Hull Cell test and the practical scale test, and the additives strength was defined by the concentrations of these additives, which was clarified to be useful for controlling the copper electrolyte. An expression as a function of the copper concentration in the electrolyte, the additives strength, the current density and the electrode space was also derived for obtaining the smooth electrodeposition, which is of great help in controlling the copper electrolysis.
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© 2002 by The Mining and Materials Processing Institute of Japan
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