Dispersion of Copper Fine Particles for Conductive Inks and Pastes

Abstract

Conductive inks and pastes consisting metal particles dispersed in an organic solvent have attracted extensive attentions for manufacturing electronic devices. Thus, development of metal particles that are stably dispersed in ink and can be sintered at a low temperature is indispensable to realize printed electronics technology. To prepare such metal particles, it is essential to synthesize monodispersed particles with the adequate surface design. Pulverization prior to ink formation becomes also important for imparting long-term stability. Copper is a promising material due to its low cost and electro-migration resistance. We have developed low-temperature sintering copper fine particle inks with long term stability by surface protection and unform dispersion of copper fine particles.