Evaluation of a Specimen Heating Method for the Development of a New Temperature Measuring Method for Semiconductor Manufacturing Equipments

Kazuaki Yamazawa; Masaru Arai; Satoshi Shibata; Hisaki Izutani; Takao Morita

doi:10.11499/sicep.2003.0_118_4

SICE Annual Conference 2003

DOI https://doi.org/10.11499/sicep.2003.0_118_4

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Host: The Society of Instrument and Control Engineers

Co-host: The IEEE Industrial Electronics Society, The IEEE Robotics and Automation Society, The IEEE Control Systems Society, The IEEE Systems, Man nad Cybernetics Society, The Instrumentation, Systems, and Automation Society

Evaluation of a Specimen Heating Method for the Development of a New Temperature Measuring Method for Semiconductor Manufacturing Equipments

*Kazuaki Yamazawa, Masaru Arai, Satoshi Shibata, Hisaki Izutani, Takao Morita

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