Application of Holographic Pattern Measuring System for Deformation Analysis of Printed Circuit Board Due to Thermal Stress

Takanori Nethu; Kazuhiro Kameyama; Masanari Taniguchi; Tasuku Takagi; Norifumi Chubachi

doi:10.11499/sicep.2004.0_116_3

SICE Annual Conference 2004

DOI https://doi.org/10.11499/sicep.2004.0_116_3

Conference information

Host: The Society of Instrument and Control Engineers

Co-host: The IEEE Industrial Electronics Society, The IEEE Robotics and Automation Society, The IEEE Control Systems Society, The IEEE Systems, Man and Cybernetics Society, The Instrumentation, Systems, and Automation Society

Application of Holographic Pattern Measuring System for Deformation Analysis of Printed Circuit Board Due to Thermal Stress

Takanori Nethu, Kazuhiro Kameyama, *Masanari Taniguchi, Tasuku Takagi, Norifumi Chubachi

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Keywords: Holography, Thermography, Thermal stress

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Pages 116

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Abstract

In this study, by using both FEMLAB and the Thermography, the thermal pattern was analyzed of thermally stressed printed circuit board along with the deformation pattern by using the Holographic Pattern Measuring System (HPMS). As the results, both thermal pattern and deformation pattern were observed as a different pattern each other. And, we found that the HPMS could be effectively used as a tool for analyzing PCB deformation with 3-D graphic image.

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