Abstract
High-precision measurement and identification of deformation in metal forming is significant. In this study, a die-embedded sensing system with micro-semiconductor sensors fabricated using semiconductor process technology was developed. The die-embedded sensing system is a new sensing tool for measuring complex phenomena by monitoring stresses in the die during the process. As a case study, we applied the die-embedded sensing system to the V-bending process. A microsensor for the measurement of the load and bending angle during processing was designed and fabricated. The results show that the new sensing system has advantages over conventional sensors.
