Abstract
A new system for the piercing process, which has high positioning accuracy and monitoring of the position during piercing, is introduced. When the piercing force on a micropiercing punch is increased in the production of microholes, the tool life becomes shorter. Furthermore, 1 μm becomes relatively large when the product is of microsize, and any difference in the tool position or punch diameter significantly affects the micropiercing. In this study, a nanometric-motion stage is included in the die as a new tooling system, enabling the control of the relative positon between the punch and die at a nanoscale. Different forces and hole conditions are observed in different punch positions, and the die position movements in X, Y, and Z directions are monitored during each micropiercing using the developed system.
