Abstract
A new technology that can be easily adapted to various circuit designs and production in small lots has been requested in electronic device manufacturing where low cost device fabrication on large area is required. We have developed a laser-assisted inkjet printing technology which can achieve high throughput and fine patterning simultaneously. To realize fine patterning with low resistivity, ejected ink-droplets have been dried by laser irradiation to suppress expansion on a substrate, a problem often observed in a conventional inkjet process. Drawing of fine wiring with aspect ratio of 1 or above with line width of 10 μm or less has been achieved using this new approach. In this paper, the achievements of laser assisted inkjet printing technology is shown based on the needs that triggered this research and the solutions used to overcome the problems met during the R&D process.
