Tetsu-to-Hagane
Online ISSN : 1883-2954
Print ISSN : 0021-1575
ISSN-L : 0021-1575
TLP Bonding of Hastelloy X with Ion Plating Filler
Tetsuro TOYODATomoaki HYODOTakao ENDO
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JOURNAL OPEN ACCESS

1996 Volume 82 Issue 6 Pages 509-513

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Abstract
The transient liquid phase bonding (TLP bonding) has been studied on a Hastelloy X whose surface is ion-plated with a self-melted tertiary alloy of a Ni-15mass% Cr-B alloy. The ion-plated coat filler contains about 2 to 4mass% boron as a melting point depressant. The thickness of the filler metal is from 3 to 12μm. It was found that the diffusion zone is narrow and the joint strength is insufficient when the content of boron is low and the thickness of a filler is thin. However, the joint strength increases sharply when the thickness reaches about 7μm. These facts were discussed on the basis of microstructural observation, the distribution of diffusion elements and the isothermal solidification time of a thin filler.
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© The Iron and Steel Institute of Japan

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