Abstract
The rapid growth of data processing speed in computers has been sustained by the advances in cooling technology. This article first presents a review of the published data of heat loads in recent Japanese large-scale computers. The survey indicates that, since around 1980, the high-level integration of microelectronic circuits has brought about almost four fold increase in the power dissipation from logic chips. The integration also has invited the evolutions of multichip modules and new schemes of electronic interconnections.
Forced convection air-cooling and liquid cooling coupled with thermal connectors are discussed with reference to the designs employed in actual computers. More advanced cooling schemes are also discussed. Finally, the importance of thermal environmental control of computer rooms is emphasized.
