Transactions of the Materials Research Society of Japan
Online ISSN : 2188-1650
Print ISSN : 1382-3469
ISSN-L : 1382-3469
Bonding and Thermal Fracture of Silicon Nitride / Stainless Steal (SUS316)
Hajime KIYONOTakayuki NUKUITakaya AKASHIShiro SHIMADA
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2008 Volume 33 Issue 4 Pages 953-956

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Abstract
Diffusion bonding and thermal fracture between Si3N4 ceramic and stainless steel (SUS316) were investigated. Sintered Si3N4 ceramics were fabricated by hot-pressing of a-Si3N4 powder with 5wt% Y2O3 and 5 – 10 wt% A2O3. Bonding between SUS316 plate with 1 mm thick and Si3N4 specimens was carried out at 8 - 24 MPa and at 1000° - 1300°C for 1 h in vacuum. Thermal decomposition of the bonded specimen in air was followed by acoustic emission and high-temperature microscope. Bonding between SUS and Si3N4 was achieved by heating at 1150 and 1200°C in vacuum. When the bonded sample was heated in air, small cracking was formed at 700°C at the interface between SUS and Si3N4, followed by decomposition of the bonded sample at 900°C.
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© 2008 The Materials Research Society of Japan
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