Preparation of thin and dense electroless-plated Pd membrane by controlling Pd deposition behavior

Abstract

Electroless Pd plating at different deposition temperatures was investigated to control Pd deposition behavior for preparing a much thinner Pd membrane to reduce Pd usage and achieve high hydrogen permeation flux. The deposition temperature directly influenced on the membrane thickness uniformity and defect formation. In our experimental condition, a thin Pd electroless-plated membrane with a thickness of 3 μm could be prepared at 333 K using a formic acid bath. It was found that this membrane showed no leakage of helium and high H₂ permeation flux. The rate-limiting step of Pd deposition during the electroless plating must be one of the important factors for preparing the thinner Pd plating membrane with no pinholes.