Effects of Pt Sacrificial Layer on Microfabrication in Layered Bismuth-based Ferroelectric Thin Films

Taiki Obayashi; Masafumi Kobune; Takuya Matsunaga; Ryo Ito; Tsubasa Migita; Takeyuki Kikuchi; Kensuke Kanda; Kazusuke Maenaka

doi:10.14723/tmrsj.45.31

Regular Papers

Effects of Pt Sacrificial Layer on Microfabrication in Layered Bismuth-based Ferroelectric Thin Films

Taiki Obayashi, Masafumi Kobune, Takuya Matsunaga, Ryo Ito, Tsubasa Migita, Takeyuki Kikuchi, Kensuke Kanda, Kazusuke Maenaka

Author information

Taiki Obayashi
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Masafumi Kobune
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Takuya Matsunaga
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Ryo Ito
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Tsubasa Migita
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Takeyuki Kikuchi
Department of Chemical Engineering and Materials Science, Graduate School of Engineering, University of Hyogo
Kensuke Kanda
Department of Electronics and Computer Sciences, Graduate School of Engineering, University of Hyogo
Kazusuke Maenaka
Department of Electronics and Computer Sciences, Graduate School of Engineering, University of Hyogo

Keywords: magnetoelectric multiferroic, (Bi_3.25Nd_0.65Eu_0.10)Ti₃O₁₂, reactive ion etching, Pt sacrificial layer

JOURNAL FREE ACCESS

2020 Volume 45 Issue 2 Pages 31-34

DOI https://doi.org/10.14723/tmrsj.45.31

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Abstract

Ferroelectric microrod films with a pitch size of 5 μm for micropillar-type multiferroic composite devices were fabricated by reactive ion etching (RIE) using epitaxial c-axis-oriented (Bi_3.25Nd_0.65Eu_0.10)Ti₃O₁₂ (BNEuT) thin films. The effects of the etching time, the presence of a 155-nm-thick sacrificial Pt layer and the thickness of this layer on the microstructure of the microrod films were examined. It was found that the use of the Pt layer during the RIE process allowed higher dimensional accuracy and straightness of the final microrod films.

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