Abstract
The boiling cooling performance of high heat generating devices is examined experimentally. Influence of various minute surface structures on the boiling heat transfer from the surface of dummy CPU is investigated. Surfaces used are smooth type, two pyramid types and two grid types. By using the minute surface structures, nucleate boiling heat transfer is enhanced. When pyramid 0.5mm type is used as the surface structure, improvement of the heat transfer is largest among the test surfaces; it is about three times of smooth surface at equal heat flux condition on the projected surface area basis. Boiling heat transfer is further enhanced when surfactant (sodium myristate) solution is used. When pyramid 0.5mm type is used with the surfactant solution of 0.1wt%, improvement is about five times of smooth surface with pure water at equal heat flux condition on the projected surface area basis.
