2017 Volume 25 Issue 4 Pages 75-78
Parametric study is conducted for optimizing the thermal performance of loop-thermosiphon for electronic cooling. We have used the Robust design for finding the optimal arrangement of loop-thermosiphon. The result shows the influence factors for temperature of heat transfer surface of heat generating device are cooling temperature, filling rate of working fluid and structure of heat transfer surface. On the other hand, those for thermal resistance are filling rate of working fluid, structure of heat transfer surface and type of working fluid. Result obtained by optimized factors show temperature reduction of heat transfer surface by 13.5K and thermal resistance by 38%. Temperature of heat transfer surface decreases with decrease in cooling temperature and filling rate as well as use of high performance heat transfer surface like pyramid 2.5mm of this study. Thermal resistance also decreases with decrease in filling rate and use of high performance heat transfer surface.