Abstract
The purpose of this paper is to find bonding parameters of electrodes between the metal printed circuit board (PCB) and flexible PCB using ultrasonic vibration. The electrodes of FPCB were electroless-plated with electroless Ni/immersion Au (ENIG) and those of metal PCB were also electroless-plated with ENIG. The peel strengths of the joints were investigated with various parameters, such as bonding pressure and time. This study showed that the electrodes between the metal PCB and FPCB were successfully bonded without any adhesive at a low temperature during a short time, compared to other bonding methods: adhesive bonding and thermo-compression bonding.
