Abstract
The purpose of this paper is to bond electrodes between the rigid printed circuit board (RPCB) and flexible PCB (FPCB) using ultrasonic vibration. The electrodes of FPCB and RPCB were Cu. The peel strengths of the joints were investigated with various parameters, such as bonding pressure and time. This study showed that the electrodes between the RPCB and FPCB were successfully bonded without any adhesive at a low temperature for a short time, compared to other bonding methods: adhesive bonding and thermo-compression bonding.
