Inst. for NanoSci. Design., Osaka Univ.
Dept. of Nut. Sci. and Food Safety., Tokyo Univ. of Agric.
Inst. of Sci. Ind. Res., Osaka Univ.
Grad. School of Eng., Osaka Univ.
2019 Volume 40 Article ID: 3P2-12
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Proceedings of Symposium on Ultrasonic Electronics
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