3Pa2-4 Nondestructive fault localization of multilayered semiconductor devices with frequency dependent ultrasound heating

Proceedings of Symposium on Ultrasonic Electronics

Online ISSN : 2433-1910
Print ISSN : 1348-8236

3Pa2-4 Nondestructive fault localization of multilayered semiconductor devices with frequency dependent ultrasound heating

Takuto Matsui, Shunya Hayashi, Tomohiro Kawashima, Yoshinobu Murakami, Naohiro Hozumi, Toru Matsumoto

Author information

JOURNAL FREE ACCESS

2020 Volume 41 Article ID: 3Pa2-4

DOI https://doi.org/10.24492/use.41.0_3Pa2-4

Details

Article 1st page

Content from these authors

© 2020 Institute for Ultrasonic Elecronics

Favorites & Alerts

Related articles

Recently viewed articles

Predecessor

Proceedings of Symposium on Ultrasonic Electronics

Top