Proceedings of Symposium on Ultrasonic Electronics
Online ISSN : 2433-1910
Print ISSN : 1348-8236
3J3-2 Ultra-low profile and high heat dissipation multi-layered SAW device employing sapphire substrate
Ryohei KomiyamaTakayuki SuzukiMasayuki KitajimaMotoi Yamauchi
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2024 Volume 45 Pages 230-

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