Reports of the Technical Conference of the Institute of Image Electronics Engineers of Japan
Online ISSN : 2758-9218
Print ISSN : 0285-3957
Reports of the 280th Technical Conference of the Institute of Image Electronics Engineers of Japan
Session ID : 16-03-24
Conference information

Visual simulation of peeling mark of adhesive seal
*Yushi MINEMURAHideki TOUDOUMasanori KAKIMOTO
Author information
CONFERENCE PROCEEDINGS RESTRICTED ACCESS

Details
Abstract
In digital animation and video games, peeling marks of adhesive seals are often used to depict our daily life. In this paper we propose a visual simulation method for adhesive seals that can reproduce the irregular geometry of peeling marks. The seal layer structure is modeled by a cubic lattice as elastic thin layers. Lattice vertices are connected by a mass-spring system with a modified Hooke’s Law, which is extended to peeling behavior of adhesive seal. A set of spring constant and breaking point is adjusted for each spring, depending on the spring directions and the adhesive layer thickness. As the result of the proposed simulation in various parameter settings, our method can reproduce plausible geometries for peeling marks.
Content from these authors
© 2017 by The Institute of Image Electronics Engineers of Japan
Previous article Next article
feedback
Top