Proceedings of JIEP Annual Meeting

Proceedings of JIEP Annual Meeting

Published by The Japan Institute of Electronics Packaging

2,953 registered articles
(updated on April 26, 2024)

CONFERENCE PROCEEDINGS FREE ACCESS

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[title in Japanese] [in Japanese], [in Japanese], [in Japanese], [in Japanese]
[title in Japanese] [in Japanese], [in Japanese], [in Japanese]
[title in Japanese] [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
[title in Japanese] [in Japanese]

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Most viewed articles (March 2024)

1

Fundamentals of Nucleation Mechanism of Electromigration in Metal Joints and Issues in Reliability

Released on J-STAGE: July 27, 2018 | The 28th JIEP Annual Meeting 7B-05

* Kimihiro Yamanaka
2

Highly Acceleration Test on Lead-Free Solder

Released on J-STAGE: July 17, 2014 | The 23th JIEP Annual Meeting 11C-08

* Masaru Morita, Nobuyuki Hayashi, Teru Nakanishi, Yasuhiro Yoneda
3

Wafer-level Three-dimensional Integration Technology using Hybrid Wafer Bonding

Released on J-STAGE: July 27, 2018 | The 27th JIEP Annual Meeting 14A-11

* Kazuyuki Hozawa
4

Making processes and their issues of through silicon via

Released on J-STAGE: October 02, 2009 | The 22th JIEP Annual Meeting 17C-01

* Sei-ichi Denda
5

Mechanism for Spontaneous Zinc Whisker Growth from an Electroplated Zinc Coating

Released on J-STAGE: July 17, 2014 | The 24th JIEP Annual Meeting 10C-01

* Alongheng Baated, Keun-Soo Kim, Katsuaki Suganuma

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