Current status and future prospects of Co Packaged Optics

Released on J-STAGE: April 01, 2022 | The 35th JIEP Annual Meeting 18C5-01

Fundamentals of Nucleation Mechanism of Electromigration in Metal Joints and Issues in Reliability

Released on J-STAGE: July 27, 2018 | The 28th JIEP Annual Meeting 7B-05

* Kimihiro Yamanaka

Wafer-level Three-dimensional Integration Technology using Hybrid Wafer Bonding

Released on J-STAGE: July 27, 2018 | The 27th JIEP Annual Meeting 14A-11

* Kazuyuki Hozawa

Technical Trend of Embedded Multi Layer Ceramic Capacitors

Released on J-STAGE: October 01, 2018 | The 29th JIEP Annual Meeting 16A2-3

Development of Bonding Technique for Power Semiconductor Devices Using Sintered Silver

Released on J-STAGE: July 27, 2018 | The 27th JIEP Annual Meeting 13F-11

* Naoya Tokoo, Takashi Ando, Yusuke Yasuda, Kazuhiro Suzuki, akitoyo Konno, Toshiaki Morita