Proceedings of JIEP Annual Meeting

Proceedings of JIEP Annual Meeting

Published by The Japan Institute of Electronics Packaging

3,084 registered articles
(updated on January 17, 2026)

CONFERENCE PROCEEDINGS FREE ACCESS

The 38th JIEP Annual Meeting

Development of slot antennas for nano-satelites [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Influence of Epoxy-based Binder to Dynamic Percolation of CNT-based Electrically Conductive Pastes [in Japanese], [in Japanese]
Materials Design for Improving Interface Strength by Use of Materials Informatics Based on Public Literature Data and Machine Learning with Molecular Simulation [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]
Measurement of thermal-contact-resistance distribution for semiconductor heat dissipation substrate by using lock-in thermography periodic heating method [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese], [in Japanese]

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Most viewed articles (December 2025)

1

Fundamentals of Nucleation Mechanism of Electromigration in Metal Joints and Issues in Reliability

Released on J-STAGE: July 27, 2018 | The 28th JIEP Annual Meeting 7B-05

* Kimihiro Yamanaka
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Current status and future prospects of Co Packaged Optics

Released on J-STAGE: April 01, 2022 | The 35th JIEP Annual Meeting 18C5-01
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Technical Trend of Embedded Multi Layer Ceramic Capacitors

Released on J-STAGE: October 01, 2018 | The 29th JIEP Annual Meeting 16A2-3
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Development of the new photo-initiator

Released on J-STAGE: July 17, 2014 | The 26th JIEP Annual Meeting 9A-11

* Masaaki Shimizu
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Low Temp. Voidless Bonding Method of Hybrid Bonding ( Parallel usage for Surface Activated and Anodic Bonding )

Released on J-STAGE: January 11, 2008 | The 20th JIEP Annual Meeting 22A-06

* Akira Yamauchi, Johji Kagami

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