Effect of Electrodeposition Conditions on Surface Roughness of Copper Electroformed Replicas
Released on J-STAGE: November 20, 2020 | Volume 25
Gota Yamaguchi, Hidekazu Mimura
Laser-Assisted Wet Etching of Silicon Back Surfaces Using 1552 nm Femtosecond Laser
Khanh Phu Luong, Rie Tanabe-Yamagishi, Noboru Yamada, Yoshiro Ito
Localized and Mask-less Copper Deposition with Free-flow Jet Micro-Electrochemical Additive Manufacturing
Released on J-STAGE: December 14, 2022 | Volume 27
Muhammad Hazak Arshad, Krishna Kumar Saxena, Rex Smith, Jun Qian, Dominiek Reynaerts
Improvement of Surface Quality of Electrochemical Machining Using Porous Electrode by Mixing Bubbles into Electrolyte
Released on J-STAGE: January 15, 2025 | Volume 29
Tomohiro Koyano, Jin Yoshida, Tatsuaki Furumoto, Akira Hosokawa
Performance of Electrochemical Discharge Machining by Forced Discharge Dispersion
Released on J-STAGE: October 31, 2014 | Volume 19 Pages 9-15
Katsushi Furutani, Hiroyuki Shintani, Yasuo Murase, Shuichi Arakawa
Already have an account? Sign in here