Analysis of Processing Mechanism in Stealth Dicing of Ultra Thin Silicon Wafer
Released on J-STAGE: August 25, 2020 | 2007.4 9D435
Etsuji OHMURA, Masayoshi KUMAGAI, Makoto NAKANO, Koji KUNO, Kenshi FUKUMITASU, and Hideki MORITA
3404 Estimation Method of Contact Stiffness of Joint based on Surface Profile Measurement
Released on J-STAGE: June 19, 2017 | 2011.6 3404
Kyoko NAKAMURA, Shinji SHIMIZU, Haruhisa SAKAMOTO, Kenichi YAMASHITA
[title in Japanese]
Released on J-STAGE: June 19, 2017 | 2003
3256 Development of Partially Ni-coated Diamond Abrasives for Electroplated Tools
Released on J-STAGE: June 19, 2017 | 2011.6 3256
Yu Zhang, Yasuhiro Tani, Junji Murata, Takahiro Hashizume
The Improvement of Tribological and Fatigue Properties of Aluminum Alloy coated DLC Hybrid Surface Modification
Released on J-STAGE: August 25, 2020 | 2007.4 8B227
* Hirorou NOMURA, Hiroyuki AKEBONO, Hideto SUZUKI
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