In this paper, we describe a connection between an aluminum alloy sheet and a resin board by using an aluminum channel with unequal sides. Electromagnetic caulking of the resin board is enabled by the use of the channel. The connection is formed by simultaneous magnetic pulse welding and caulking. The experimental conditions for this process are almost the same as conditions for welding. A moving sheet deformed by an electromagnetic force collides with the bottom face of the channel, and they can be joined to each other. At the end of the joining process, both the sheet and the bottom face finish plastic deformation. The resin board inserted into the channel is locked by work-hardening to the sheet and the channel. A polycarbonate board and a polyacetal board can be caulked by both impact force and electromagnetic force, but an acrylic board is destroyed when subjected to force. The success or failure of caulking mainly depends on characteristic values of the resin board, and they are an impact strength and an elongation.

In general, Ti-6Al-4V alloy sheets are formed by press forming in the temperature range between 600 and 900 ℃. In this temperature range, the ductility of Ti-6Al-4V alloy is improved. Because of the low ductility of Ti-6Al-4V alloy at temperatures between room temperature and 600 ℃, fracture easily occurs during press forming. Hence, a method of drawing and ironing Ti-6Al-4V alloy sheets at room temperature was developed. In this method, the punch motion and blank holding force were applied separately to prevent fracture at the punch shoulder. Because of the shear transformation occurred by the motion control, it was confirmed that fracture was prevented at room temperature during drawing and ironing. In addition, by applying the developed method, we were able to prevent the decrease in thickness at the punch shoulder, compared with the case of press forming. As a result, the cold drawing and ironing Ti-6Al-4V alloy sheets at room temperature were achieved by applying the developed method in experiments and finite element analysis.