Thermal Science and Engineering

Thermal Science and Engineering

Published by The Heat Transfer Society of Japan

211 registered articles
(updated on April 13, 2026)

Online ISSN : 1882-2592
Print ISSN : 0918-9963
ISSN-L : 0918-9963

JOURNAL PEER REVIEWED FREE ACCESS

2026 Volume 34 Issue 2

Development of a Diffusion Model within Paper Fibers for the Paper Expansion Phenomenon during the Fusing Process Kimiharu YAMAZAKI, Keigo FURUSHIMA, Koichi KATO, Shinichi KURAMOTO, Kazuyoshi FUSHINOBU

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Most viewed articles (March 2026)

1

Reconsideration of Young’s equation

Released on J-STAGE: May 08, 2008 | Volume 16 Issue 1 Pages 49-60

Yukihiro YONEMOTO, Tomoaki KUNUGI
2

Proposal to International Standard of Thermal Resistance Junction to Case (θJC) of Semiconductor Devices

Released on J-STAGE: February 18, 2015 | Volume 23 Issue 1 Pages 1-4

Takuya SHINODA, Noritaka INOUE, Tetsuya ITO
3

Fundamental study on predicting thermal contact resistance of uniform contact

Released on J-STAGE: November 17, 2023 | Volume 31 Issue 3 Pages 19-30

Hirotoshi AOKI, Koichi HIRASAWA, Hiroyuki YAMAGUCHI, Kazuyoshi FUSHINOBU, Toshio TOMIMURA
3

The Optimum Plate to Plate Spacing for Maximum Heat Transfer Rate from a Flat Plate Type Heat Exchanger

Released on J-STAGE: April 25, 2009 | Volume 17 Issue 1 Pages 1-8

Himsar AMBARITA, Koki KISHINAMI, Mashashi DAIMARUYA, Ikuo TOKURA, Hideki KAWAI, Jun SUZUKI, Mashayosi KOBIYAMA, Armansyah GINTING
3

The Effects of Frame and Inlet Sizes of Electronic Casing-Mounted Cooling Fans on Their P-Q Characteristics

Released on J-STAGE: April 23, 2009 | Volume 16 Issue 4 Pages 147-156

Takashi FUKUE, Takafumi YOSHIMOTO, Masaru ISHIZUKA, Shinji NAKAGAWA

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