Journal of SHM
Online ISSN : 1884-1198
Print ISSN : 0919-4398
ISSN-L : 0919-4398
A New Encapsulationg Method Using Thin Resin Sheets
Hideo Ota, Tetsuo Okuyama, Shinetsu Fujieda
Author information
JOURNAL FREE ACCESS

1996 Volume 12 Issue 4 Pages 32-36

Details
Download PDF (3154K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© The Japan Institute of Electronics Packaging
Previous article Next article
Favorites & Alerts

Recently viewed articles
Predecessor

HYBRIDS

Circuit Technology

Successor

Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

Share this page
feedback
 Top