Circuit Technology

Circuit Technology

Published by The Japan Institute of Electronics Packaging

444 registered articles
(updated on December 07, 2025)

Online ISSN : 1884-118X
Print ISSN : 0914-8299
ISSN-L : 0914-8299

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1994 Volume 9 Issue 7

The Mechanism of Migration Phenomenon for Fine Pitch Packaging Yoshinobu ANBE
Ceramic Printed Circuit Board Material Akira IMOTO, Kazumasa FURUHASHI
An Automatic Supporting System for PWB Design Takeshi YOSHIDA, Toshiro KUTSUWA, Ken-ichi KOBORI, Katsuhiko EBATA
Soldering Technology of Fine Pitch Packages Haruo MISHINA

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Most viewed articles (November 2025)

1

The Soldering in Nitrogen Atmosphere and the Trends in Development of Nitrogen Atmosphere Ref low Soldering Furnace

Released on J-STAGE: March 18, 2010 | Volume 6 Issue 4 Pages 222-228

Tetsuya OKUNO
2

Laminates for Microwave Circuit Boards

Released on J-STAGE: March 18, 2010 | Volume 8 Issue 2 Pages 110-114

Morio GAKU
3

Mechanical Properties of Electroless Copper Deposit

Released on J-STAGE: March 18, 2010 | Volume 1 Issue 2 Pages 44-51

Tomoyoshi SHIBUYA, Hideo HONMA
4

Printed Wiring Board Material for High Frequency Circuit

Released on J-STAGE: March 18, 2010 | Volume 9 Issue 3 Pages 215-221

Katsutoshi HIRAKAWA
5

Development of Alkaline-Soluble Photo-Imageable Liquid Solder Resists

Released on J-STAGE: March 18, 2010 | Volume 3 Issue 6 Pages 349-353

Yoshiaki IWAYA, Akira TANIMURA

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Journal of The Japan Institute of Electronics Packaging

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits

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