Micro-tensile bond strengths of the newly developed one-step bonding system “One-Up Bond F Plus”

Abstract

This in vityo study aimed to evaluate the micro-tensile bond strengths (μ TBS) of the newly developed bonding system (One-Up Bond F Plus, OBF-plus, Tokuyama Dental Co.) and the already widely used one-step bonding system (One-Up Bond F, OBF, Tokuyama Dental Co.). Thirty extracted human molars were used in this study. After removal of enamel, middle dentin surfaces were ground flat with # 600 grit SiC paper, and then treated with OBF or OBF-plus adhesives (Tokuyama Dental Co.) using three application methods (20 seconds inactive application, 10 seconds active application and 20 seconds active application). After the adhesives were light-cured for 20 seconds, composites (Clearfil APX. Kurarav Co.) crowns were built up, followed by the storage in 37°C water for 24 hours. The specimens were then subjected to micro-tensile bond test at a crosshead speed of 1.0mm/minute. The treated dentin surfaces and the resin-dentin interfaces with OBF or OBF-plus were observed by SEM. There was no significant difference in μ TBS between OBF and OBF-plus using 20 seconds inactive application. For 10 and 20 seconds active application, μ TBS of OBF-plus was significantly higher than that of OBF. SEM observation of the treated dentin surface showed that OBF-plus with active application has an advantage of removal of the smear layer compared to OBF with active application.