Abstract
Eaves formation is a problem that occurs in a micro-plating pattern in OFR (Dry Film photoResist) lithography. From SEM (Scanning Electron Microscope) observation and XMA (X-ray Micro Analysis) identification, it is found that a cross-sectional shape of caves is like bird's-beak. As a factor of caves formation, it is found that the adhesion energies balance at the three-fold of Cu substrate/DFR/developer solution. Thus, adeveloper is likely to intrude into the interface of Cu substrate/OFR to form n micro gap. However, the bird's-beak like eaves is not merely caused by the gap (however it is formed). It was found that the Ni plating solution intrudes into the Cu substrate/DFR interface, and the shape of eaves is fanned with the growth of the plating. From these results, we propose a model of the eaves formation.
