Eaves formation is a problem that occurs in a micro-plating pattern in OFR (Dry Film photoResist) lithography. From SEM (Scanning Electron Microscope) observation and XMA (X-ray Micro Analysis) identification, it is found that a cross-sectional shape of caves is like bird's-beak. As a factor of caves formation, it is found that the adhesion energies balance at the three-fold of Cu substrate/DFR/developer solution. Thus, adeveloper is likely to intrude into the interface of Cu substrate/OFR to form n micro gap. However, the bird's-beak like eaves is not merely caused by the gap (however it is formed). It was found that the Ni plating solution intrudes into the Cu substrate/DFR interface, and the shape of eaves is fanned with the growth of the plating. From these results, we propose a model of the eaves formation.

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No poisonous irritating gas is generated by decomposition of biodegradable polymer. Biodegradable adhesive was prepared by using biodegradable polymer containing rice bran. The adhesive was applied to wood as hot melt type. Any change in adhesive strength was not observed when the sample was exposed to air for long time. However, once the sample was buried in soil, the adhesive strength decreased considerably within two months. At the same time, the weight and the molecular weight of the polymers used as adhesive also fairly reduced. This extent became more considerable with the increase of rice bran. Thus, the above blend can be applied to wood industries as an environmentally friendly adhesive.

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