Abstract
Theepoxyresin-basedpastebondingadhesivescauseseriousproblemsinfabricatingstackedintegratedcircuits(ICs).Inanattempttosolvesuchproblemsandsimplifytheprocedure,dualcuringwasstudiedonthemixedformulationsofUV-curablepressuresensitiveadhesives(PSAs)andthermallycurableepoxyr､esins・AnUV-curablePSAwascomposedofanacryliccopolymeranddipentaeritbrytolhexaacrylate(DPHA).FormulationstudyonUV-curableandepoxyresinmixturesfoundtwomajorfactorsforbettercompatibilityandsuitablepropertiesasPSA.Onefactorwastheincorporationofglycidylmetbacrylate(GMA)intothecopolymer.andtheotherwastheepoxycomponentwasamixtureofliquidandsolidbispbenolAglycidylethersandaphenol-novolaktypeepoxyresin.TheUVcuringofsuchaformulationconvei､tedtheadhesivelayei､tothatofexcellentdicingperformancesandeasypickingupofsemiconductordicewithitself.Furtherthermalcuringoftheadhesivelayerthusobtainedconverteditbondinglayerwithsuchanincreasedelasticmodulusas1.0×10**Paevenathighertemperaturethan150C.Bycomparingwithacommerciallyavailabledicingtapeandepoxypaste-bondingagent,itwasascertainedthatthenewlydevelopedformulationhasmorethanequaldicingandbondingperformances.
