Abstract
Recently, dismantlement of adhesively bonded joints has been required to recycle the materials of adherends.So that, we developed a new kind of adhesive: "dismantlableadhesive".The joints bonded with the adhesive were peeled off easily by adding heat due to the expansion of thermally expansive microcapsules included in it.Thermal expansion of the microcapsules and the dismantlable adhesive was measured keeping applied hydrostatic pressure usinga Pressure-Volume-Temperature apparatus.The microcapsule began to expand drastically at around 60℃ under atmospheric pressure and 1MPa.However, the expansion started at around 80-90℃ under 2MPa and 3MPa.They swelled over 60 times in volume at 100℃ under atmospheric pressure but not more than 10 times at 1MPa.The dismantlable adhesive was also expanded similarly to the experiment using only the microcapsules.In addition, volume modulus of the dismantlable adhesive was measured using the PVT apparatus.
